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Journals
4
Archives of Metallurgy and Materials
Years
1
2020
1
2019
2
2017
Authors
4
Lee J.-H.
1
Choi E. B.
1
Choi W. L.
1
Hwang J. H.
1
Jo K. H.
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Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste
100%
Jo K. H.
,
Lee J.-H.
,
Jo K. H.
,
Lee J.-H.
Archives of Metallurgy and Materials
|
2020
|
vol.
65
|
issue
3
2
Full text local access
Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles
89%
Lee J.-H.
,
Hwang J. H.
Archives of Metallurgy and Materials
|
2017
|
vol.
62
|
issue
2
3
Full text local access
Preparation of Submicroscale Ag-Coated Cu Particles by Multi-Step Addition of Ag Plating Solution and Antioxidation Properties for Different Ag Shell Thicknesses
89%
Choi E. B.
,
Lee J.-H.
Archives of Metallurgy and Materials
|
2017
|
vol.
62
|
issue
2
4
Full text local access
Characteristics of Die-Attach Method by Sinter Bonding Using AG-40CU Mechanically Alloyed Particles
89%
Choi W. L.
,
Lee J.-H.
Archives of Metallurgy and Materials
|
2019
|
vol.
64
|
issue
2
Page
/ 1
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