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Archives of Metallurgy and Materials
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2017
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Kim K. T.
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Kim S. S.
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Son I.
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Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
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Son I.
,
Kim S. S.
,
Kim K. T.
Archives of Metallurgy and Materials
|
2017
|
vol.
62
|
issue
2
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/ 1
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