PL EN


Preferences help
enabled [disable] Abstract
Number of results
2014 | 125 | 6 | 1374-1376
Article title

Design, Modeling and Simulation of MEMS Devices on Si, SiC, and Diamond for Harsh Environment Applications

Content
Title variants
Languages of publication
EN
Abstracts
EN
Set of micromechanical (MEMS) test structures designed for fabrication on silicon, silicon carbide and diamond substrates has been successfully designed. A dedicated mask-set development has been carried along with numerical simulations performed with assistance of a dedicated design and modelling CoventorWare™ - toolset by Coventor. A set of sample simulations presented in this paper has been performed for specific simulation domains focused on silicon-alternative material reality to proof the usefulness of proposed substrates. The aim was to verify its applicability for MEMS design and confirm an outstanding performance of the resulting device which effectively opens a new area of interest for subsequent research and development efforts.
Keywords
Contributors
  • Lublin University of Technology, Nadbystrzycka 38a, 20-618 Lublin, Poland
author
  • Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
author
  • Institute of Electron Technology, al. Lotników 32/46, 02-668 Warszawa, Poland
References
  • [1] R. Cheung, Silicon Carbide Micro Electromechanical Systems for Harsh Environments, Imperial College Press, London 2006, doi: 10.1142/9781860949098
  • [2] P.M. Sarro, Sensors Actuators 82, 210 (2000), doi: 10.1016/S0924-4247(99)00335-0
  • [3] R.S. Sussmann, CVD Diamond for Electronic Devices and Sensors, Wiley, London 2009, doi: 10.1002/9780470740392.ins
  • [4] http://www.diamond-materials.com
  • [5] A. Kociubiński, M. Duk, T. Bieniek, G. Janczyk, Przegląd Elektrotechniczny 7, 221 (2010) http://pe.org.pl/issue.php?lang=1&num=07/2010
  • [6] T. Bieniek, G. Janczyk, P. Janus, J. Szynka, P. Grabiec, A. Kociubiński, M. Ekwińska, D. Tomaszewski, A. Malinowski, J. Telecommun. Inform. Technol. 1, 34 (2010) http://www.nit.eu/czasopisma/JTIT/2010/1/34.pdf
  • [7] D.S. Greywall, J. Micromechan. Microeng. 9, 78 (1999), doi: 10.1088/0960-1317/9/1/310
  • [8] E. Forsén, G. Abadal, S.G. Nilsson, J. Verd, R. Sandberg, W. Svendsen, J. Teva, F. Peréz-Murano, J. Esteve, E. Figueras, F. Campabadal, L. Montelius, N. Barniol, A. Boisen, in: 18th IEEE Int. Conf. Micro Electro Mechanical Syst. 2005, Miami 2005, p. 867, doi: 10.1109/MEMSYS.2005.1454067
  • [9] W. Zhang, K.L. Turner, Sensors Actuators A, Phys. 122, 23 (2005), doi: 10.1016/j.sna.2004.12.033
  • [10] http://www.coventor.com
  • [11] G. Janczyk, T. Bieniek, J. Wąsowki, P. Grabiec, Microelectronics Journal 45, (2014), doi: 10.1016/j.mejo.2014.01.013
Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv125n632kz
JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page.