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Journal
2009 | 7 | 2 | 379-384
Article title

Structural, morphology and electrical properties of layered copper selenide thin film

Content
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Languages of publication
EN
Abstracts
EN
Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.
Publisher
Journal
Year
Volume
7
Issue
2
Pages
379-384
Physical description
Dates
published
1 - 6 - 2009
online
26 - 4 - 2009
References
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Document Type
Publication order reference
YADDA identifier
bwmeta1.element.-psjd-doi-10_2478_s11534-009-0057-1
Identifiers
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