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Number of results

Journal

2009 | 7 | 2 | 379-384

Article title

Structural, morphology and electrical properties of layered copper selenide thin film

Content

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Languages of publication

EN

Abstracts

EN
Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.

Contributors

  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
author
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia

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Document Type

Publication order reference

Identifiers

YADDA identifier

bwmeta1.element.-psjd-doi-10_2478_s11534-009-0057-1
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