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PN-ISO 690:2012
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Journal
Metrology and Measurement Systems
2016
|
23
|
3
|
Article title
Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes
Authors
Damian Bisewski
,
Marcin Myśliwiec
,
Krzysztof Górecki
,
Ryszard Kisiel
,
Janusz Zarębski
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PL
Abstracts
Keywords
PL
Schottky diodes
transient thermal impedance
thermal measurements
Silicon carbide
packaging
Nauki Techniczne
Publisher
Polska Akademia Nauk
Journal
Metrology and Measurement Systems
Year
2016
Volume
23
Issue
3
Physical description
Contributors
author
Damian Bisewski
author
Marcin Myśliwiec
author
Krzysztof Górecki
author
Ryszard Kisiel
author
Janusz Zarębski
References
Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.oai-journals-pan-pl-106339
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