Image Depth Profiling AES

• Authors: T. Sekine , T. Sato
• Languages of publication: EN

Abstracts

EN

Image depth profiling AES incorporating an image processing technique has been developed. This method reconstructs a cross-sectional image from acquired 2-dimensional and/or 3-dimensional data. A binary image produced from a secondary electron image through image processing can be used to cut the area of interest for selected area analysis. In a failure analysis of a relay contact, we found by cross-sectional image observation that Fe and Ni permeate from pin holes in an Au layer covering a Fe-Ni alloy. A VTR head made of a polycrystalline ferrite core covered with a Sendust (Si-Al-Fe alloy) layer at the gap has been analyzed. Depth distributions of Al, 0, and Fe on different grains, and Al and O distributions near grain boundaries have been successfully reassembled from the 3-dimensional data.

Keywords

EN

68.35.Dv

Discipline

• 68.35.Dv: Composition, segregation; defects and impurities

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 1992
• Volume: 81
• Issue: 1
• Pages: 145-157

Dates

published

1992-01

received

1991-05-21

(unknown)

1991-08-10

Contributors

author

T. Sekine

• Jeol Ltd., 3-1-2 Musashino, Akishima, Tokyo 196, Japan

author

T. Sato

• Jeol Ltd., 3-1-2 Musashino, Akishima, Tokyo 196, Japan

Identifiers

DOI

10.12693/APhysPolA.81.145