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Number of results
2011 | 120 | 1 | 105-107

Article title

Formation of Cone-Shaped Inclusions and Line Defects on the Cz-Si Wafer Surface by the Helium Implantation and DC Nitrogen Plasma Treatment

Content

Title variants

Languages of publication

EN

Abstracts

EN
The general goal of this work is to investigate the defects formed on the surface of the Cz-Si wafers subjected to helium implantation, vacuum annealing and nitrogen plasma treatment. The performed scanning electron microscopy study has shown that in the general case two types of surface defects can be formed: cone-shaped inclusions with the base diameter of 0.2-2 μm and the ratio of diameter to height of approximately 1:1, as well as crystallographically oriented line defects with the length equal to 0.2-2 μm. The concentration of these defects depends on the conditions of implantation and plasma treatment.

Keywords

EN

Year

Volume

120

Issue

1

Pages

105-107

Physical description

Dates

published
2011-07

Contributors

  • Belarussian National Technical University, 65, Nezavisimosti St., 220063 Minsk, Belarus
author
  • Belarussian State University, 4, Nezavisimosti St., 220030 Minsk, Belarus
  • Belarussian National Technical University, 65, Nezavisimosti St., 220063 Minsk, Belarus
  • Lublin University of Technology, Nadbystrzycka 38, 20-618 Lublin, Poland
author
  • Lublin University of Technology, Nadbystrzycka 38, 20-618 Lublin, Poland

References

  • 1. N.V. Frantskevich, A.V. Frantskevich, A.K. Fedotov, A.V. Mazanik, Solid State Phenomena 156-158, 91 (2010)
  • 2. B. Terreault, Physica Status Solidi A 204, 2129 (2007)
  • 3. A.V. Frantskevich, A.M. Saad, A.V. Mazanik, N.V. Frantskevich, A.K. Fedotov, V.S. Kulinkauskas, A.A. Patryn, J. Mater. Sci. Mater. Electron. 19, S239 (2008)

Document Type

Publication order reference

Identifiers

YADDA identifier

bwmeta1.element.bwnjournal-article-appv120n126kz
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