Analysis of Thin Films by Time-of-Flight Low Energy Ion Scattering

• Authors: S. Průša , M. Kolíbal , P. Bábor , J. Mach , T. Šikola
• Languages of publication: EN

Abstracts

EN

In the paper the design and application of a time-of-flight low energy ion scattering instrument built into an UHV complex deposition and analytical apparatus is described. A special attention is aimed at demonstrating the ability of time-of-flight low energy ion scattering to analyse near-to-surface layers of thin films prepared both ex situ and in situ. It is shown that the broadening of peaks in time-of-flight low energy ion scattering spectra can be attributed to multiple scattering and inelastic losses of ions in deeper layers. As a result of that, the peak width of ultrathin films depends on their thickness.

Keywords

EN

68.49.Sf; 81.05.Cy; 68.55.-a; 81.15.Ef

Discipline

• 81.05.Cy: Elemental semiconductors(for semiconductors in electrochemistry, see 82.45.Vp)
• 68.55.-a: Thin film structure and morphology(for methods of thin film deposition, film growth and epitaxy, see 81.15.-z)
• 68.49.Sf: Ion scattering from surfaces (charge transfer, sputtering, SIMS)

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2007
• Volume: 111
• Issue: 3
• Pages: 335-341

Dates

published

2007-03

received

2006-09-01

(unknown)

2007-03-05

(unknown)

2007-04-10

Contributors

author

S. Průša

• Institute of Physical Engineering, Brno University of Technology, Technicka 2896/2, 616 69 Brno, Czech Republic

author

M. Kolíbal

• Institute of Physical Engineering, Brno University of Technology, Technicka 2896/2, 616 69 Brno, Czech Republic

author

P. Bábor

• Institute of Physical Engineering, Brno University of Technology, Technicka 2896/2, 616 69 Brno, Czech Republic

author

J. Mach

• Institute of Physical Engineering, Brno University of Technology, Technicka 2896/2, 616 69 Brno, Czech Republic

author

T. Šikola

• Institute of Physical Engineering, Brno University of Technology, Technicka 2896/2, 616 69 Brno, Czech Republic

References

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• 7. Hamamatsu MCP Assembly, Technical Information, Cat. No. TMCP9001E03, Hamamatsu Photonics K.K., 1991
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Identifiers

DOI

10.12693/APhysPolA.111.335