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Number of results
2007 | 9 | 2 | 5-9

Article title

Synthesis of photoreactive solvent-free acrylic pressure-sensitive adhesives in the recovered system

Content

Title variants

Languages of publication

EN

Abstracts

EN
The present paper discloses a novel photoreactive solvent-free acrylic pressure-sensitive adhesive (PSA) systems, especially suitable for the so much adhesive film applications as the double-sided, single-sided or carrier-free technical tapes, self-adhesive labels, protective films, marking and sign films and wide range of medical products. The novel photoreactive solvent-free pressure-sensitive adhesives contain no volatile organic compounds (residue monomers or organic solvent) and comply with the environment and legislation. The synthesis of this new type of acrylic PSA is conducted in common practice by solvent polymerisation. After the organic solvent are removed, there remains a non-volatile, solvent-free highly viscous material, which can be processed on a hot-melt coating machine at the temperatures of about 100 to 140°C.

Publisher

Year

Volume

9

Issue

2

Pages

5-9

Physical description

Dates

published
1 - 1 - 2007
online
19 - 10 - 2007

Contributors

author
  • ChemCycle Bitterfeld GmbH, 06758 Wolfen, Germany
  • Institute of Chemical Organic Technology, Szczecin University of Technology, ul. Pulaskiego 10, 70-322 Szczecin, Poland
  • Institute of Chemical Organic Technology, Szczecin University of Technology, ul. Pulaskiego 10, 70-322 Szczecin, Poland

References

  • Czech Z.: Crosslinking of acrylic PSA, Published by Szczecin University of Technology, Szczecin, 1999 (ISBN 83-87423-18-1).
  • Chandran M.: EP 0 608 891, National Starch and Chemical, 1994.
  • Kurzawa R., Czech Z.: Ginekologia po dyplomie, wydanie specjalne, styczeń, 2007, 1 - 5.
  • Benedek I.: Developments in Pressure-Sensitive Products, Edited by Taylor & Francis a CRC Press Book, 2006.
  • Czech Z., Drzycimska A., Klementowska P.: European Coating Journal, 2007, 2, 26 - 30.
  • Czech Z.: DE 195 01 24, Lohmann, 1995.
  • Czech Z.: DE 195 01 25, Lohmann, 1995.
  • Auchter G.: Adhäsion, 1993, 1 - 2, 14 - 20.
  • Czech Z.: Adhäsion, 1996, 9, 24 - 29.
  • Shiaonung S.: US Patent 5,252,662, Avery Dennison Corporation, 1993.

Document Type

Publication order reference

Identifiers

YADDA identifier

bwmeta1.element.-psjd-doi-10_2478_v10026-007-0014-y
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