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Diffusion Kinetics of Binary Ti-Ni Shape Memory Alloys

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Ucar N., Dogan S., Ozdemir A., Karakas S., Calik A.
Acta Physica Polonica A
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2017
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vol. 132
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issue 3
524-526
EN
In this work, the boriding of binary Ti-Ni shape memory alloys was carried out in a solid medium at 1173 and 1273 K for 2, 4, and 8 h using the powder pack method with Ekabor-Ni powders. The boride layer was characterized by optical microscopy and scanning electron microscopy. The obtained results show that boride layer thickness increases with the increasing boriding temperature and time. Depending on temperature and boride layer thickness, the diffusion process is thermally activated, with the mean value of the activation energy being close to 67 kJ/mol.
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The Effect of Chromium Addition on Physical Properties of Cu-Al Based High Temperature Shape Memory Alloy

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Deniz Çirak Z., Kök M., Aydoğdu Y.
Archives of Metallurgy and Materials
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2018
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vol. 63
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issue 4
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