Full-text resources of PSJD and other databases are now available in the new Library of Science.
Visit https://bibliotekanauki.pl
Preferences help
Polish version English version Language
enabled [disable] Abstract
Number of results

Results found: 2

Number of results on page
first rewind previous Page / 1 next fast forward last

Search results

help Sort By:

help Limit search:
first rewind previous Page / 1 next fast forward last
1
Content available remote

Formation and characterization of CuxS layers on polyethylene film using the solutions of sulfur in carbon disulfide

100%
Ancutienė I., Janickis V.
Open Chemistry
|
2010
|
vol. 8
|
issue 6
1281-1287
EN
Results of the formation of copper sulfide layers using the solutions of elemental sulfur in carbon disulfide as precursor for sulfurization are presented. Low density polyethylene film can be effectively sulfurized in the solutions of rhombic (α) sulfur in carbon disulfide. The concentration of sulfur in polyethylene increases with the increase of the temperature and concentration of sulfur solution in carbon disulfide and it little depends on the duration of sulfurization. Electrically conductive copper sulfide layers on polyethylene film were formed when sulfurized polyethylene was treated with the solution of copper (II/I) salts. CuxS layer with the lowest sheet resistance (11.2 Ω cm−2) was formed when sulfurized polyethylene was treated with copper salts solution at 80°C. All samples with formed CuxS layers were characterized by X-ray photoelectron spectroscopy. XPS analysis of obtained layers showed that on the layer’s surface and in the etched surface various compounds of copper, sulfur and oxygen are present: Cu2S, CuS, CuO, S8, CuSO4, Cu(OH)2 and water. The biggest amounts of CuSO4 and Cu(OH)2 are present on the layer’s surface. Significantly more copper sulfides are found in the etched layers.
2
Content available remote

Comparison of the efficacy of sulfurization agents in decreasing the sheet resistance of polyamide and polyethylene with copper sulfide layers and influence of their compositions

81%
Ivanauskas R., Ancutienė I., Janickis V., Stokienė R.
Open Chemistry
|
2009
|
vol. 7
|
issue 4
864-869
EN
The process of obtaining semiconductive and electrical conductive layers of copper sulfides by the sorption - diffusion method on polymers (polyamide 6 and low density polyethylene) using solutions of potassium pentathionate, K2S5O6, and higher polythionic acids, H2Sn O6 (n = 21, 33), was investigated. The layers were characterized for compositional and electrical properties by X-ray diffraction (XRD) analysis and sheet resistance measurements. The thickness of copper sulfides layers on polyamide and polyethylene increased with increasing time of polymer sulfurization and varied from 10 to 43 µm. The variations of the sheet resistance of copper sulfides layers formed on the surface of polymers on sulfurization agent used, the conditions of sulfurization, chemical and phase composition of the obtained layers were established. Sheet resistance of copper sulfides layers decreases with increasing time of the duration of sulfurization and the number of sulfur atoms in the polythionate anion. The sheet resistance values for copper sulfide layers formed on the polyamide surface are much lower than those of Cux S formed on the polyethylene surface. XRD showed the predomination of Cux S phases with low x values. [...]
first rewind previous Page / 1 next fast forward last
JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page.