Full-text resources of PSJD and other databases are now available in the new Library of Science.
Visit https://bibliotekanauki.pl

Refine search results

Journals help

  1. 1 Acta Physica Polonica A

Years help

  1. 1 2017

Authors help

  1. 1 Erer M.

  2. 1 Omaç F.

  3. 1 Ozyurek D.

Preferences help
Polish version English version Language
enabled [disable] Abstract
Number of results

Results found: 1

Number of results on page
first rewind previous Page / 1 next fast forward last

Search results

help Sort By:

help Limit search:
first rewind previous Page / 1 next fast forward last
1
Content available remote

Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

100%
Omaç F., Ozyurek D., Erer M.
Acta Physica Polonica A
|
2017
|
vol. 131
|
issue 1
165-167
EN
In the present study, wetting behaviors of Sn-9Zn-xAl ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-xAl alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9°C. It was determined that wetting capability of Sn-9Zn-xAl alloys failed because of oxidation.
first rewind previous Page / 1 next fast forward last
JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page.