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Archives of Metallurgy and Materials
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2012
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Boczkal G.
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Marecki P.
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Perek-Nowak M.
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The Influence of Soldering Conditions on Conductivity, Structure and Strength of Cu/Sn96Ag4 Solders
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Perek-Nowak M.
,
Boczkal G.
,
Marecki P.
Archives of Metallurgy and Materials
|
2012
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issue
1
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/ 1
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