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Top down nano technologies in surface modification of materials

100%
Radjenović B., Radmilović-Radjenović M.
Open Physics
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2011
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vol. 9
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issue 2
265-275
EN
This article contains a broad overview of etch process as one of the most important top-down technologies widely used in semiconductor manufacturing and surface modification of nanostructures. In plasma etching process, the complexity comes from the introduction of new materials and from the constant reduction in dimensions of the structures in microelectronics. The emphasis was made on two types of etching processes: dry etching and wet etching illustrated by three dimensional (3D) simulation results for the etching profile evolution based on the level set method. The etching of low-k dielectrics has been demonstrated via modelling the porous materials. Finally, simulation results for the roughness formation during isotropic etching of nanocomposite materials as well as smoothing of the homogeneous materials have also been shown and analyzed. Simulation results, presented here, indicate that with shrinking microelectronic devices, plasma and wet etching interpretative and predictive modeling and simulation have become increasingly more attractive as a tool for design, control and optimization of plasma reactors.
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The Welded Joints Structure of the Inconel 617 Alloy Designed for High Temperature Operation in Supercritical Parameters Boilers

72%
Adamiec J., Konieczna N., Adamiec J., Konieczna N.
Archives of Metallurgy and Materials
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2020
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vol. 65
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issue 1
3
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Bubbles: A review of their relationship to the formation of thin films and porous materials

72%
Kolasinski K. W.
Mesoporous Biomaterials
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2014
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vol. 1
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issue 1
EN
Bubbles arise at the intersection of gases with other phases. Their role in the formation and applications of thin films and porous materials is complex. At times they are to be avoided. In other cases they are essential to the desired properties and outcomes. In many cases their function, form and production are misunderstood or disregarded. This review seeks to connect a diverse array of technical and fundamental aspects of bubbles so as to facilitate more control and understanding of their functions and utility
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