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Microstructure and Mechanical Properties of Lead-Free Solder Joints

100%
Harcuba P., Trško L.
|
EN
In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.
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Ultrasonic Control of Ductile Cast Iron Castings by Phased Array Technique

71%
Boháčik M., Mičian M., Koňár R., Trško L., Winczek J.
Archives of Foundry Engineering
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2019
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vol. 19
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issue 2
3
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The Very High Cycle Fatigue Behaviour of Ti-6Al-4V Alloy

61%
Janeček M., Nový F., Harcuba P., Stráský J., Trško L., Mhaede M., Wagner L.
Acta Physica Polonica A
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2015
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vol. 128
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issue 4
497-502
EN
The high cycle and very high cycle fatigue properties of the titanium alloy Ti-6Al-4V with a duplex microstructure were investigated at room temperature. High cycle fatigue tests were performed in the range from 10⁴ to 10⁷ cycles by rotating bending at the frequency of 30 Hz. The very high cycle fatigue tests were carried out in the range from 10⁷ to 10¹⁰ cycles in tension-compression on an ultrasonic fatigue testing machine at the frequency of 20 kHz. The stress amplitude was found to decrease with increasing number of cycles in the whole range from 10⁴ up to 10⁹ cycles and only at the highest number of cycles (N_{F}=10⁹) the alloy exhibits the fatigue limit of 460 MPa. The detail fractographic analysis was performed to characterize the fatigue failure mechanisms. Both subsurface and surface crack initiation were observed in very high cycle fatigue region. No inclusions, but only local chemical inhomogeneity in microstructure was observed at the locations of subsurface fatigue crack initiation in alpha-grains.
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