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Acta Physica Polonica A
|
1991
|
vol. 80
|
issue 2
149-160
EN
After a short general description of the chemical etching of semiconductors the mechanisms of defect-selective etching are described in detail. Two distinct mechanisms that lead to the formation of etch pits and etch hillocks on dislocations emerging at a semiconductor surface are discussed. The principles of the formation of defect-related etch features are described for the HF-CrO_{3}-H_{2}O etching system used for etching of GaAs. A model of surface reactions is presented and the influence of illumination during etching on the defect-selectivity is emphasized. The use of ultra sensitive photoetching to study the nature and origin of complex defects in SI and n-like GaAs is documented. In particular, the concept for the formation of dislocation cell structure in undoped GaAs is presented and the ability of photoetching to reveal the structural changes during annealing is visualized.
EN
In this note we report briefly on the details of pulsed-current operated "blue" laser diode, constructed in our laboratories, which utilizes bulk GaN substrate. As described in Ref. [1] the substrate GaN crystal was grown by HNPSG method, and the laser structure was deposited on the conducting substrate by MOCVD techniques (for the details see Sec. 2 and Sec. 4 of Ref.~[1], respectively).
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