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2015 | 70 | 1 |
Article title

Changes in surface properties of polymethylmethacrylate (PMMA) treated with air plasma

Content
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Languages of publication
EN
Abstracts
Keywords
EN
 
Year
Volume
70
Issue
1
Physical description
Dates
published
2015
online
10 - 02 - 2016
Contributors
References
  • H. Jung, B. Gweon, D.B. Kim and W. Choe, Plasma Process. Polym. 8, 535-41, (2011).
  • C. Tendero, C Tixier, P. Tristant,, J. Desmaison and P. Leprince, Spectrochim. Acta B 61, 2-30, (2006).
  • A. Fridman, A. Chirokov and A. Gutsol, J. Phys. D. Appl. Phys. 38, R1-R24, (2005).
  • O. Sakai, Y. Kishimoto and K. Tachibana, J. Phys. D. Appl. Phys. 38, 431-41, (2005).
  • W.S. Kang, H.S. Kim and S.H. Hong, Thin. Solid. Films 518, 6578-82, (2010).
  • P.K. Chu, J.Y. Chen, L.P. Wang and N. Huang, Mater. Sci. Eng. R36, 143-206, (2002).
  • B. Gupta, J. Hilborn, C. Hollenstein, C.J.G. Plummer, R. Houriet and N. Xanthopoulos, J. Appl. Polym. Sci. 78, 1083-91, (2000).
  • M.D. Barankin, E. Gonzalez II, S.B. Habib, L. Gao, P.C. Guschl and R.F. Hicks, Langmuir 25, 2495-2500, (2009).
  • F. Luthon and F. Clément, Int. Conf. on Automation, Quality & Testing, Robotics, AQTR'06, Cluj-Napoca Romania, Conference Proceeding 1-6, (2006).
  • K.T. Chu, Y. Oshida, E.B. Hancock, M.J. Kowolik, T. Barco and S. Zunt, Hydroxyapatite/PMMA composites as bone cements, Biomed. Mater. Eng. 14, 87-105, (2004).
  • F. Galli, S. Benedetti, U. Buoncristiani, M. Piroddi, C. Conte, F. Canestrari, E. Buoncristiani and A. Floridi, Kidney Int. 64 (2), 748-755, (2003).
  • D. Cokeliler, S. Erkut, J. Zemek, H. Biederman and M. Mutlu, Modification of glass fibers to improve reinforcement: A plasma polymerization technique, Dent. Mater. 23, 335-342, (2007).
  • J. Han, G. Ma and J. Ni, Mat. Sci. Eng. C 31, 1278-84, (2011).
  • J. Dalby, L. Di Silvio and E.J. Harper, W. Bonfield, Biomat. 23, 569-76, (2002).
  • J.E. Klemberg-Sapieha, L. Martinu, N.L.S. Yamasaki and C.W. Lantman, Thin Solid Films 476, 101-07, (2005).
  • M.I.J. Beale, C. Broughton, A. Pidduck, F.G.H. Smith, A.G. Brown, V.G.I. Deshmukh, T.W. Janes, S.H. Mortimer and S.J. Till, The mechanism of ion implantation passivation of PMMA for lithography with dry etch development, Microelectron. Eng. 3, 451-458, (1985).
  • S. Guruvenket , G.R.S. Iyer , L. Shestakova, P. Morgen, N.B. Larsen and G. Mohan Rao, Appl. Surf. Sci. 254, 5722-26, (2008).
  • K. Tsougeni, P.S. Petrou, A. Tserepi, S.E. Kakabakos and E. Gogolides, Microelec. Engin. 86, 1424-42, (2009).
  • Ch. Liu, N.-Y. Cui, S. Osbeck and H. Liang, Appl. Surf. Sci. 259, 840-46 (2012).
  • U. Schulz, P. Munzert and N. Kaiser, Surf. Coat. Technol. 142-44, 507-11, (2001).
  • T. Homola, J. Matousek, B. Herelova, M. Kormunda, L.Y.L. Wu and M. Cernak, Polym. Degrad. Stab. 97, 886-92, (2012).
  • C.J. van Oss, R.J. Good and M.K. Chaudhury, J. Colloid Interf. Sci. 111, 378-90, (1986).
  • C.J. van Oss, R.J. Good and M.K. Chaudhury, Langmuir 4, 884-91, (1988).
  • C.J. van Oss, Colloids Surf. A 78, 1- 49, (1993).
  • E. Chibowski, In: Contact Angle, Wettability and Adhesion, K.L. Mittal (Ed.), Ultrecht: VSP, vol. 2, 265-88, (2002).
  • E. Chibowski and R. Perea-Carpio, Adv. Colloid Interface Sci. 98, 245-64, (2002).
  • E. Chibowski, Adv. Colloid Interf. Sci. 103, 149-72, (2003).
  • E. Chibowski, Adv. Colloid Interf. Sci. 113, 121-31, (2005).
  • D. S. Bodas and S.A. Gangal, Materials Letters 59, 2903-07, (2005).
  • A. Kondyurin and M. Bilek, Nuclear Instrum. Methods Phys. Res. B 269, 1361-69 (2011).
  • A. Vesel and M. Mozetic, Vacuum 86, 634- 37, (2012).
  • Ch. Liu, Nai-Yi Cui, S. Osbeck and H. Liang, Appl. Surf. Sci. 259, 840-46, (2012).
  • U. Schulz, P. Munzert and N. Kaiser, Surf. Coat. Technol. 142-144, 507-11, (2001).
  • H. Radelczuk, L. Hołysz and E. Chibowski, J. Adhesion Sci. Technol. 16, 1547-68, (2002).
Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.ojs-doi-10_17951_aa_2015_70_1_65
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