EN
Al_{0.3}Ga_{0.7}As layers were grown by molecular beam epitaxy using substrate temperature 200-300°C, tetrameric As and two values of As/Ga+Al flux ratio i.e. 3 or 8. The post-growth annealing was performed in situ at 600°C for 20 min under As-overpressure. The samples were characterised by reflection high-energy electron diffraction, transmission electron microscope and room-temperature I-V measurements of n^{+}/LT grown layer /n^{+} resistors. The resistivity and trap-filled limited voltage have been determined. The best layers exhibited ρ of the order of 10^{9} Ω cm, were monocrystalline, uniformly precipitated and without dislocations.