Title variants
Languages of publication
Abstracts
A flux of silver atoms reevaporated from the copper and nickel targets during deposition of silver was measured as a function of the target temperature during spontaneous cooling from 1150 K and during heating the target with deposited several silver monolayers from room temperature to 1150 K. Differences in the measured dependences for both targets give the evidence of competition between reevaporation of silver atoms from the copper surface and their dissolution in the copper bulk and are in accordance with the lack of silver dissolution in nickel. Thus, the role of silver dissolution in the copper surface layer during silver adsorption at elevated temperatures is experimentally evidenced. Activation energy for silver dissolution in the copper substrate was estimated to be equal to 1.7-2.4 eV/atom.
Discipline
Journal
Year
Volume
Issue
Pages
69-74
Physical description
Dates
published
1996-01
received
1995-07-25
(unknown)
1995-10-16
Contributors
author
- Institute of Experimental Physics, University of Wrocław, Pl. Maxa Borna 9, 50-204 Wrocław, Poland
author
- Institute of Experimental Physics, University of Wrocław, Pl. Maxa Borna 9, 50-204 Wrocław, Poland
References
Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv89z105kz