Preferences help
enabled [disable] Abstract
Number of results
2017 | 132 | 2 | 225-228
Article title

Modeling, Simulation and Characterization of Aluminum Implantation in 4H-SiC for Large-Area Photodiode Technology

Title variants
Languages of publication
Simulation, modeling and characterization of the aluminum ion implantation in 4H-SiC for large-area photodiode technology have been presented in this paper. Modeling and simulation have been performed using the SRIM and TCAD software EDA environments. Main goals were to present and compare the single vs. multiple ion implantation results as well to develop processes leading to achieve required implantation profiles.
  • Lublin University of Technology, Nadbystrzycka 38a, 20-618 Lublin, Poland
  • [1] S.E. Saddow, A. Agarwal, Advances in Silicon Carbide Processing and Applications, Artech House, 2004
  • [2] B.J. Baliga, Silicon Carbide Power Devices, World Sci, 2005
  • [3] T. Kimoto, J.A. Cooper, Fundamentals of Silicon Carbide Technology: Growth, Characterization, Devices and Applications, Wiley, 2014, doi: 10.1002/9781118313534.ch1
  • [4] M.V. Rao, Solid State Electron. 47, 213 (2003), doi: 10.1016/S0038-1101(02)00197-1
  • [5] E. Wendler, A. Heft, W. Wesch, Nucl. Instrum. Methods Phys. Res. B 141, 105 (1998), doi: 10.1016/S0168-583X(98)00083-4
  • [6] M. Rambach, F. Schmid, M. Krieger, L. Frey, A.J. Bauer, G. Pensl, H. Ryssel, Nucl. Instrum. Methods Phys. Res. B 237, 68 (2005), doi: 10.1016/j.nimb.2005.04.079
  • [7] V.A. Gubanov, C.Y. Fong, Appl. Phys. Lett. 75, 88 (1999), doi: 10.1063/1.124285
  • [8] T. Bieniek, G. Janczyk, P. Janusz, J. Szynka, P. Grabiec, A. Kociubiński, M. Ekwińska, D. Tomaszewski, A. Malinowski, J. Telecommun. Inf. Technol. 1, 34 (2010)
  • [9] D. Ortloff, T. Schmidt, K. Hahn, T. Bieniek, G. Janczyk, R. Brück, MEMS Product Engineering, Springer, Vienna 2014, doi: 10.1007/978-3-7091-0706-5
  • [10] A. Kociubiński, T. Bieniek, G. Janczyk, Acta. Phys. Pol. A 125, 1374 (2014)), doi: 10.12693/APhysPolA.125.1374)
  • [11] J. Romanek, D. Grambole, F. Herrmann, M. Voelskow, M. Posselt, W. Skorupa, J. Żuk, Nucl. Instrum. Methods Phys. Res. B 251, 148 (2006), doi: 10.1016/j.nimb.2006.06.005
  • [12] A. Heft, E. Wendler, T. Bachmann, E. Glaser, W. Wesch, Mater. Sci. Eng. B 29, 142 (1995), doi: 10.1016/0921-5107(94)04025-Y
  • [13] F. Pezzimenti, F.G. Della Corte, R. Nipoti, Microelectron. J. 39, 1594 (2008), doi: 10.1016/j.mejo.2008.02.005
  • [14] M. Rambach, A.J. Bauer, H. Ryssel, Phys. Status Solidi 245, 1315 (2008), doi: 10.1002/pssb.200743510
  • [15] J.F. Ziegler, M.D. Ziegler, J.P. Biersack, Nucl. Instrum. Methods Phys. Res. B 268, 1818 (2010), doi: 10.1016/j.nimb.2010.02.091
  • [16] F.G. Della Corte, F. Pezzimenti, R. Nipoti, Microelectron. J. 38, 1273(2007), doi: 10.1016/j.mejo.2007.09.024
  • [17] M. Turek, S. Prucnal, A. Drozdziel, K. Pyszniak, Nucl. Instrum. Methods Phys. Res. B 269, 700 (2011), doi: 10.1016/j.nimb.2011.01.133
  • [18] A. Kociubiński, M. Duk, D. Teklinska, N. Kwietniewski, M. Sochacki, M. Borecki, Proc. SPIE 9228, 922804 (2014), doi: 10.1117/12.2061287
  • [19] A. Kociubiński, M. Duk, M. Masłyk, N. Kwietniewski, M. Sochacki, M. Borecki, M. Korwin-Pawłowski, Proc. SPIE 8903, 89030V (2013), doi: 10.1117/12.2035436
  • [20] A. Kociubiński, M. Duk, M. Korona, K. Muzyka, Proc. SPIE 9662, 96620V (2015), doi: 10.1117/12.2205737
  • [21] A. Kociubiński, M. Borecki, M. Duk, M. Sochacki, M.L. Korwin-Pawlowski, Microelectron. Eng. 154, 48 (2016), doi: 10.1016/j.mee.2016.01.041
  • [22] A. Kociubinski, M. Duk, T. Bieniek, G. Janczyk, M. Borecki, in: Int. 3D Systems Integration Conf. (3DIC), Kinsdale, (Ireland), 2014, 15291809, doi: 10.1109/3DIC.2014.7152181
  • [23] M. Borecki, A. Kociubiński, M. Duk, N. Kwietniewski, M.L. Korwin-Pawlowski, P. Doroz, J. Szmidt, Proc. SPIE 8903, 89030H (2013), doi: 10.1117/12.2034797
  • [24] P. Prus, M. Borecki, M.L. Korwin-Pawlowski, A. Kociubiński, M. Duk, Proc. SPIE 9290, 929009 (2014), doi: 10.1117/12.2074463
  • [25] M. Borecki, M.L. Korwin-Pawlowski, M. Duk, A. Kociubiński, J. Frydrych, P. Prus, J. Szmidt,, Sensors Transduct. 193, 11 (2015)
  • [26] M. Borecki, P. Doroz, P. Prus, P. Pszczolkowski, J. Szmidt, M.L. Korwin-Pawlowski, J. Frydrych, A. Kociubinski, M. Duk, Int. J. Adv. Syst. Meas. 7, 57 (2014)
  • [27] M. Borecki, P. Doroz, J. Szmidt, M.L. Korwin-Pawlowski, A. Kociubiński, M. Duk, in: SENSORDEVICES 2013, The Fourth Int. Conf. on Sensor Device Technologies and Applications, 2013, p. 19
Document Type
Publication order reference
YADDA identifier
JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page.