Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

• Authors: F. Omaç , D. Ozyurek , M. Erer
• Languages of publication: EN

Abstracts

EN

In the present study, wetting behaviors of Sn-9Zn-xAl ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-xAl alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9°C. It was determined that wetting capability of Sn-9Zn-xAl alloys failed because of oxidation.

Keywords

EN

81.05.Bx

Discipline

• 81.05.Bx: Metals, semimetals, and alloys

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2017
• Volume: 131
• Issue: 1
• Pages: 165-167

Dates

published

2017-01

Contributors

author

F. Omaç

• Karabuk University, Technology Faculty, Manufacturing Eng., 78100 Karabuk, Turkey

author

D. Ozyurek

• Karabuk University, Technology Faculty, Manufacturing Eng., 78100 Karabuk, Turkey

author

M. Erer

• Karabuk University, Science Faculty of Physics, 78100 Karabuk, Turkey

References

• [1] R.A. Islam, Y.C. Chan, W. Jillek, S. Islam, Microelectron. J. 37, 705 (2006), doi: 10.1016/j.mejo.2005.12.010
• [2] M. Abtew, G. Selvaduray, Mater. Sci. Eng. R. 27, 95 (2000), doi: 10.1016/S0927-796X(00)00010-3
• [3] S.K. Das, A. Sharif, Y.C. Chan, N.B. Wong, W.K.C. Yung, J. Alloys Comp. 481, 167 (2009), doi: 10.1016/j.jallcom.2009.03.017
• [4] D. Özyürek, B. Yavuzer, T. Tunçay, J. Adhes. Sci. Technol. 30, 1662 (2016), doi: 10.1080/01694243.2016.1157432
• [5] K.L. Lin, T.P. Liu, Oxidat. Met. 50, 314 (1998), doi: 10.1023/A:1018840405283
• [6] J. Hashim, L. Looney, M.S.J. Hashmi, J. Mater. Process. Technol. 119, 324 (2001), doi: 10.1016/S0924-0136(01)00975-X
• [7] S.C. Cheng, K.L. Lin, J. Electron. Mater. 31, 940 (2002), doi: 10.1007/s11664-002-0187-3
• [8] K. Suganuma, K.S. Kim, J. Mater. Sci. Mater. Electron. 121, 127 (2007), doi: 10.1007/s10854-006-9018-2
• [9] J. Jiang, J.E. Lee, K.S. Kim, K. Suganuma, J. Alloys Comp. 462, 244 (2008), doi: 10.1016/j.jallcom.2007.08.007
• [10] S. Vaynman, M.E. Fine, J. Electron. Mater. 29, 1160 (2000), doi: 10.1007/s11664-000-0007-6

Identifiers

DOI

10.12693/APhysPolA.131.165