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2017 | 131 | 1 | 165-167
Article title

Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate

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EN
Abstracts
EN
In the present study, wetting behaviors of Sn-9Zn-xAl ternary lead-free solder alloys produced by the addition of Al in various amounts binary Sn-9Zn eutectic lead-free solder alloy (wt%) were investigated. Contact angles of alloys were measured by using of the sessile drop method. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of Al on microstructure were investigated. As a result, the studies show that Al-rich areas were found on microstructure of Sn-9Zn-xAl alloys. The lowest melting temperature for Sn-9Zn-0.5Al and Sn-9Zn-0.7Al alloys was determined as 200.9°C. It was determined that wetting capability of Sn-9Zn-xAl alloys failed because of oxidation.
Keywords
EN
Publisher

Year
Volume
131
Issue
1
Pages
165-167
Physical description
Dates
published
2017-01
Contributors
author
  • Karabuk University, Technology Faculty, Manufacturing Eng., 78100 Karabuk, Turkey
author
  • Karabuk University, Technology Faculty, Manufacturing Eng., 78100 Karabuk, Turkey
author
  • Karabuk University, Science Faculty of Physics, 78100 Karabuk, Turkey
References
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Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv131n146kz
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