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2016 | 130 | 1 | 492-495
Article title

Boriding of Binary Ni-Ti and Ternary Ni-Ti-Cu Shape Memory Alloys

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EN
Abstracts
EN
In this work, the boriding of binary (Ni-Ti) and ternary (Ni-Ti-Cu) shape memory alloys was carried out in a solid medium at 1173 K for 8 h using the powder pack method with Ekabor-Ni powders. Characterization of boride layer formed on the surface of alloys was identified by optical microscopy and scanning electron microscopy. TiB₂, NiB₂ and SiC phases in the boride layer of borided binary (Ni-Ti) and ternary (Ni-Ti-Cu) shape memory alloys was confirmed by X-ray diffraction analysis. The microhardness and thickness of the boride layers were measured. The obtained hardness values show a hardness anomaly due to porosity and structural defects with increase of Cu content, while a decrease in the value of hardness moving from the boride layer to main structure was observed.
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Contributors
author
  • Physics Department, Faculty of Arts and Sciences, Suleyman Demirel University, Isparta, Turkey
author
  • Physics Department, Faculty of Arts and Sciences, Suleyman Demirel University, Isparta, Turkey
author
  • Physics Department, Faculty of Arts and Sciences, Suleyman Demirel University, Isparta, Turkey
author
  • Manufacturing Engineering Department, Faculty of Technology, Suleyman Demirel University, Isparta, Turkey
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Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv130n1131kz
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