Anodic Oxide Films on Niobium and Tantalum in Different Aqueous Electrolytes and Their Impedance Characteristics

• Authors: N. Verma , K. Singh , B. Marí , M. Mollar , J. Jindal
• Languages of publication: EN

Abstracts

EN

The anodic oxide films were prepared on the niobium and tantalum in aqueous electrolyte mixtures containing 1 M CH₃COOH + 1 M H₃PO₄ or 1 M CH₃COOH + 1 vol.% HF or 1 M CH₃COOH + 1 M H₃PO₄ + 1 vol.% HF at 30 V for 30 min. The barrier films were obtained on both niobium and tantalum surfaces in all electrolyte mixtures except niobium oxide film formed in 1 M CH₃COOH + 1 vol.% HF which is porous in nature. The anodic oxide films were characterized by FESEM. Also, electrochemical impedance spectroscopy at open-circuit potential on Nb and Ta was applied and obtained data were analyzed by fitting with four different equivalent circuits.

Keywords

EN

68.37.Hk; 68.55.J-; 68.60.Bs

Discipline

• 68.60.Bs: Mechanical and acoustical properties
• 68.37.Hk: Scanning electron microscopy (SEM) (including EBIC)
• 68.55.J-: Morphology of films

• Journal: Acta Physica Polonica A
• Year: 2016
• Volume: 129
• Issue: 3
• Pages: 297-303

Dates

published

2016-03

(unknown)

01-20

received

2014-11-22

(unknown)

2016-01 12, 2016

Contributors

author

N. Verma

• Department of Chemistry, Maharshi Dayanand University, Rohtak 124001, Haryana, India

author

K. Singh

• Department of Chemistry, Maharshi Dayanand University, Rohtak 124001, Haryana, India

author

B. Marí

• Institut de Disseny per la Fabricació Automatitzada, Departament de Física Aplicada, Universitat Politècnica de València, Camí de Vera s/n, 46022 València, Spain

author

M. Mollar

• Institut de Disseny per la Fabricació Automatitzada, Departament de Física Aplicada, Universitat Politècnica de València, Camí de Vera s/n, 46022 València, Spain

author

J. Jindal

• Department of Chemistry, Maharshi Dayanand University, Rohtak 124001, Haryana, India

References

• [1] S. Hornkjol, Electrochim. Acta 36, 1443 (1991), doi: 10.1016/0013-4686(91)85332-2
• [2] J.H. Hsieh, R. Lee, R.A. Erck, G.R. Fenske, Y.Y. Su, M. Marek, R.F. Hochman, Surf. Coat. Technol. 49, 83 (1991), doi: 10.1016/0257-8972(91)90036-V
• [3] T. Balaji, R. Govindaiah, M.K. Sharma, Y. Purushotham, A. Kumar, T.L. Prakash, Mater. Lett. 56, 560 (2002), doi: 10.1016/S0167-577X(02)00552-9
• [4] J.E. Yoo, J. Choi, Electrochem. Commun. 13, 298 (2011), doi: 10.1016/j.elecom.2011.01.009
• [5] H. Stormer, A. Weber, V. Fischer, E.I. Tiffee, D. Gerthsen, J. Eur. Ceram. Soc. 29, 1743 (2009), doi: 10.1016/j.jeurceramsoc.2008.10.019
• [6] S.V.J. Chandra, S. Uthanna, G.M. Rao, Appl. Surf. Sci. 254, 1953 (2008), doi: 10.1016/j.apsusc.2007.08.005
• [7] S. Rho, D. Jahng, J.H. Lim, J. Choi, J.H. Chang, S.C. Lee, K.J. Kim, Biosens. Bioelectron. 23, 852 (2008), doi: 10.1016/j.bios.2007.09.001
• [8] T. Tamai, M. Haneda, T. Fujitani, H. Hamada, Catal. Commun. 8, 885 (2007), doi: 10.1016/j.catcom.2006.09.004
• [9] R. Binions, C.J. Carmalt, I.P. Parkin, Meas. Sci. Technol. 18, 190 (2007), doi: 10.1088/0957-0233/18/1/024
• [10] T. Shishido, T. Miyatake, K. Teramura, Y. Hitomi, H. Yamashita, T. Tanaka, J. Phys. Chem. C113, 18713 (2009), doi: 10.1021/jp901603p
• [11] A.G.S. Prado, L.B. Bolzon, C.P. Pedroso, A.O. Moura, L.L. Costa, Appl. Catal. B Environ. 82, 219 (2008), doi: 10.1016/j.apcatb.2008.01.024
• [12] M.T. Tanvir, Y. Aoki, H. Habazaki, Appl. Surf. Sci. 255, 8383 (2009), doi: 10.1016/j.apsusc.2009.05.094
• [13] A. Ochsenbein, F. Chai, S. Winter, M. Traisnel, J. Breme, H.F. Hildebrand, Acta Biomater. 4, 1506 (2008), doi: 10.1016/j.actbio.2008.03.012
• [14] K. Cho, J. Lee, J.S. Lim, H. Lim, J. Lee, S. Park, C.Y. Yoo, S.T. Kim, U.I. Chung, J.T. Moon, Microelectron. Eng. 80, 317 (2005), doi: 10.1016/j.mee.2005.04.032
• [15] J. Li, D. Yi, J. Wen, H. Zhong, H. Liu, Trans. Nonferrous Met. Soc. China 16, 848 (2006), doi: 10.1016/S1003-6326(06)60338-5
• [16] A. Michaelis, Advanced Ceramic Oxides for Electronics, Fraunhofer IRB Verlag, Stuttgart 2006. http://publica.fraunhofer.de/documents/N-48565.html
• [17] J.S. Yoon, S.W. Cho, Y.S. Kim, B. Kim, Met. Mater. Int. 15, 405 (2009), doi: 10.1007/s12540-009-0405-0
• [18] H. Habazaki, T. Ogasawara, H. Konno, K. Shimizu, S. Nagata, K. Asami, K. Takayama, P. Skeldon, G.E. Thompson, J. Electrochem. Soc. 153, B173 (2006), doi: 10.1149/1.2184909
• [19] R.L. Aagard, Appl. Phys. Lett. 27, 605 (1975), doi: 10.1063/1.88304
• [20] B. Ohtani, K. Iwai, S. Nishimoto, T. Inui, J. Electrochem. Soc. 141, 2439 (1994), doi: 10.1149/1.2055139
• [21] X. Cheng, Q. Gou, J. Wu, X. Wang, B. Zhang, D. Xiao, J. Zhu, X. Wang, X. Lou, Ceram. Int. 40, 5771 (2014), doi: 10.1016/j.ceramint.2013.11.016
• [22] M. Mazur, M. Szymanska, D. Kaczmarek, M. Kalisz, D. Wojcieszak, J. Domaradzki, F. Placido, Appl. Surf. Sci. 301, 63 (2014), doi: 10.1016/j.apsusc.2014.01.144
• [23] D.L. Zhang, P.R. Hua, Y.M. Cui, C.H. Chen, E.Y.B. Pun, J. Lumin. 127, 453 (2007), doi: 10.1016/j.jlumin.2007.02.035
• [24] S.K. Mahesh, P.P. Rao, T.L. Francis, V.R. Reshmi, P. Koshy, Mater. Lett. 120, 115 (2014), doi: 10.1016/j.matlet.2014.01.045
• [25] I. Sieber, H. Hildebrand, A. Friedrich, P. Schmuki, Electrochem. Commun. 7, 97 (2005), doi: 10.1016/j.elecom.2004.11.012
• [26] R.L. Karlinsey, Electrochem. Commun. 7, 1190 (2005), doi: 10.1016/j.elecom.2005.08.027
• [27] G. Ramirez, S.E. Rodil, S. Muhl, D.T. Ortega, J.J. Olaya, M. Rivera, E. Camps, L.E. Alarcon, J. Non-Cryst. Solids 356, 2714 (2010), doi: 10.1016/j.jnoncrysol.2010.09.073
• [28] N. Ozer, M.D. Rubin, C.M. Lampert, Solid En. Mater. Sol. Cells 40, 285 (1996), doi: 10.1016/0927-0248(95)00147-6
• [29] J.P. Masse, H. Szymanowski, O. Zabeida, A. Amassian, J.E.K. Sapieha, L. Martinu, Thin Solid Films 515, 1674 (2006), doi: 10.1016/j.tsf.2006.05.047
• [30] B. Tzvetkov, M. Bojinov, A. Girginov, J. Solid State Electrochem. 13, 1215 (2009), doi: 10.1007/s10008-008-0651-y
• [31] J. Choi, J.H. Lim, S.C. Lee, J.H. Chang, K.J. Kim, M.A. Cho, Electrochim. Acta 51, 5502 (2006), doi: 10.1016/j.electacta.2006.02.024
• [32] M.B.J.G. Freitas, L.O.S. Bulhoes, J. Appl. Electrochem. 27, 612 (1997), doi: 10.1023/A:1018415215961
• [33] N. Magnussen, L. Quinones, D.C. Dufner, D.L. Cocke, E.A. Schweikert, B.K. Patnaik, C.V.B. Leite, G.B. Baptista, Chem. Mater. 1, 220 (1989), doi: 10.1021/cm00002a011
• [34] C. Liu, Q. Bi, A. Leyland, A. Matthews, Corros. Sci. 45, 1257 (2003), doi: 10.1016/S0010-938X(02)00214-7
• [35] P. Pasierb, S. Komornicki, R. Gajerski, S. Kozinski, P. Tomczyk, M. Rekas, J. Electroceram. 8, 49 (2002), doi: 10.1023/A:1015599202914
• [36] A. Wahl, M. Ulmann, A. Carroy, B. Jermann, M. Dolata, P. Kedzierzawski, C. Chatelain, A. Monnier, J. Augustynski, J. Electroanal. Chem. 396, 41 (1995), doi: 10.1016/0022-0728(95)04023-H
• [37] M. Radecka, M. Wierzbicka, M. Rekas, Physica B Condens. Matter 351, 121 (2004), doi: 10.1016/j.physb.2004.05.020
• [38] Q. Lu, S. Mato, P. Skeldon, G.E. Thompson, D. Masheder, Thin Solid Films 429, 238 (2003), doi: 10.1016/S0040-6090(02)01292-0
• [39] O. Kerrec, D. Devilliers, H. Groult, M. Chemla, Electrochim. Acta 40, 719 (1995), doi: 10.1016/0013-4686(94)00330-4
• [40] J.W. Schultze, V.A. Macagno, Electrochim. Acta 31, 355 (1986), doi: 10.1016/0013-4686(86)80090-1

Identifiers

DOI

10.12693/APhysPolA.129.297