PL EN


Preferences help
enabled [disable] Abstract
Number of results
2015 | 128 | 4 | 750-753
Article title

Microstructure and Mechanical Properties of Lead-Free Solder Joints

Authors
Content
Title variants
Languages of publication
EN
Abstracts
EN
In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.
Keywords
EN
Contributors
author
  • Charles University in Prague, Department of Physics of Materials, Prague, Czech Republic
author
  • Research Center of the University of Žilina, Žilina, Slovak Republic
References
  • [1] F. Gao, T. Takemoto, H. Nishikawa, J. Electron. Mater. 35, 2081 (2006), doi: 10.1007/s11664-006-0317-4
  • [2] F. Gao, T. Takemoto, H. Nishikawa, Mater. Sci. Eng. A 420, 39 (2006), doi: 10.1016/j.msea.2006.01.032
  • [3] J. Shen, M.L. Zhao, P.P. He, Y.Y. Pu, J. Alloys Comp. 574, 451 (2013), doi: 10.1016/j.jallcom.2013.05.156
  • [4] J.Y. Tsai, Y.C. Hu, C.M. Tsai, C.R. Kao, J. Electron. Mater. 32, 1203 (2003), doi: 10.1007/s11664-003-0012-7
  • [5] T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, A.K. Dahle, J. Electron. Mater. 37, 32 (2008), doi: 10.1007/s11664-007-0281-7
  • [6] G.D. Li, Y.W. Shi, H. Hao, Z.D. Xia, Y.P. Lei, F. Guo, J. Alloys Comp. 491, 382 (2010), doi: 10.1016/j.jallcom.2009.10.190
  • [7] K. Nogita, C.M. Gourlay, J. Read, T. Nishimura, S. Suenaga, A.K. Dahle, Mater. Trans. 49, 443 (2008), doi: 10.2320/matertrans.MBW200713
  • [8] J.F. Li, P.A. Agyakwa, C.M. Johnson, Acta Mater. 59, 1198 (2011), doi: 10.1016/j.actamat.2010.10.053
  • [9] P. Harcuba, M. Janecek, J. Electron. Mater. 39, 2553 (2010), doi: 10.1007/s11664-010-1373-3
Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv128n467kz
JavaScript is turned off in your web browser. Turn it on to take full advantage of this site, then refresh the page.