Microstructure and Mechanical Properties of Lead-Free Solder Joints

• Authors: P. Harcuba , L. Trško
• Languages of publication: EN

Abstracts

EN

In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.

Keywords

EN

06.60.Vz; 67.80.bf; 71.20.Lp

Discipline

• 71.20.Lp: Intermetallic compounds
• 67.80.bf: Liquid-solid interfaces; growth kinetics
• 06.60.Vz: Workshop procedures (welding, machining, lubrication, bearings, etc.)

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2015
• Volume: 128
• Issue: 4
• Pages: 750-753

Dates

published

2015-10

Contributors

author

P. Harcuba

• Charles University in Prague, Department of Physics of Materials, Prague, Czech Republic

author

L. Trško

• Research Center of the University of Žilina, Žilina, Slovak Republic

References

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Identifiers

DOI

10.12693/APhysPolA.128.750