Title variants
Languages of publication
Abstracts
In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.
Discipline
Journal
Year
Volume
Issue
Pages
750-753
Physical description
Dates
published
2015-10
Contributors
author
- Charles University in Prague, Department of Physics of Materials, Prague, Czech Republic
author
- Research Center of the University of Žilina, Žilina, Slovak Republic
References
- [1] F. Gao, T. Takemoto, H. Nishikawa, J. Electron. Mater. 35, 2081 (2006), doi: 10.1007/s11664-006-0317-4
- [2] F. Gao, T. Takemoto, H. Nishikawa, Mater. Sci. Eng. A 420, 39 (2006), doi: 10.1016/j.msea.2006.01.032
- [3] J. Shen, M.L. Zhao, P.P. He, Y.Y. Pu, J. Alloys Comp. 574, 451 (2013), doi: 10.1016/j.jallcom.2013.05.156
- [4] J.Y. Tsai, Y.C. Hu, C.M. Tsai, C.R. Kao, J. Electron. Mater. 32, 1203 (2003), doi: 10.1007/s11664-003-0012-7
- [5] T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, A.K. Dahle, J. Electron. Mater. 37, 32 (2008), doi: 10.1007/s11664-007-0281-7
- [6] G.D. Li, Y.W. Shi, H. Hao, Z.D. Xia, Y.P. Lei, F. Guo, J. Alloys Comp. 491, 382 (2010), doi: 10.1016/j.jallcom.2009.10.190
- [7] K. Nogita, C.M. Gourlay, J. Read, T. Nishimura, S. Suenaga, A.K. Dahle, Mater. Trans. 49, 443 (2008), doi: 10.2320/matertrans.MBW200713
- [8] J.F. Li, P.A. Agyakwa, C.M. Johnson, Acta Mater. 59, 1198 (2011), doi: 10.1016/j.actamat.2010.10.053
- [9] P. Harcuba, M. Janecek, J. Electron. Mater. 39, 2553 (2010), doi: 10.1007/s11664-010-1373-3
Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv128n467kz