Microstructure and Mechanical Properties of Lead-Free Solder Joints

Harcuba, P.; Trško, L.

doi:10.12693/APhysPolA.128.750

Journal

Acta Physica Polonica A

2015 | 128 | 4 | 750-753

Article title

Microstructure and Mechanical Properties of Lead-Free Solder Joints

Authors

P. Harcuba , L. Trško

Content

Full texts:

http://przyrbwn.icm.edu.pl/APP/PDF/128/a128z4p67.pdf [remote]

Title variants

Languages of publication

Abstracts

In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.

Keywords

06.60.Vz 67.80.bf 71.20.Lp

Discipline

Publisher

Journal

Acta Physica Polonica A

Year

2015

Volume

128

Issue

Pages

750-753

Physical description

Dates

published

2015-10

Contributors

author

P. Harcuba

Charles University in Prague, Department of Physics of Materials, Prague, Czech Republic

author

L. Trško

Research Center of the University of Žilina, Žilina, Slovak Republic

References

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Document Type

Publication order reference

Identifiers

DOI

10.12693/APhysPolA.128.750

YADDA identifier

bwmeta1.element.bwnjournal-article-appv128n467kz