The Effect of Milling Speed on Particle Size and Morphology of Cu25W Composite Powder

• Authors: S. Biyik , M. Aydin
• Languages of publication: EN

Abstracts

EN

In this study, the effect of milling speed on particle size and morphology of Cu25W composite powder produced by high-energy ball milling was investigated. For this aim, commercial elemental copper and tungsten powders were milled in a planetary-type ball mill for different milling durations. Ball-to-powder weight ratio was selected as 10:1. Three different milling speeds, namely 200, 300, and 400 rpm were used throughout the tests. In order to avoid agglomeration and to decrease the tendency of cold welding among powder particles, stearic acid in amount of 2 wt.% was used as a process control agent. The morphological and microstructural evolution of the milled powders was evaluated by scanning electron microscopy. In addition, the variation of particle size and powder morphology as a function of milling duration was determined. As a result of this effort, the milling duration was found to have strong effect on the structural evolution of the powder, and the optimum particle size as a function of milling speed was determined.

Keywords

EN

81.20.Ev

Discipline

• 81.20.Ev: Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2015
• Volume: 127
• Issue: 4
• Pages: 1255-1260

Dates

published

2015-04

Contributors

author

S. Biyik

• Karadeniz Technical University, Department of Metallurgical and Materials Engineering, 61080 Trabzon, Turkey

author

M. Aydin

• Karadeniz Technical University, Department of Mechanical Engineering, 61080 Trabzon, Turkey

References

• [1] C. Suryanarayana, Mechanical Alloying and Milling, Marcel Dekker Press, New York 2004
• [2] P.R. Soni, Mechanical Alloying: Fundamentals and Applications, Cambridge International Science, Cambridge 1999
• [3] C. Suryanarayana, Non-equilibrium Processing of Materials, Pergamon Press, Oxford 1999
• [4] C. Suryanarayana, Prog. Mater. Sci. 46, 1 (2001), doi: 10.1016/s0079-6425(99)00010-9
• [5] Z. Lin, S. Liu, X. Sun, M. Xie, J. Li, X. Li, Y. Chen, J. Chen, D. Huo, M. Zhang, Q. Zhu, M. Liu, J. Alloy. Compd. 588, 30 (2014), doi: 10.1016/j.jallcom.2013.10.222
• [6] S. Biyik, F. Arslan, Proc. 6th Int. Powder Metallurgy Conf. and Ex., Ankara 2011, p. 671
• [7] C. Leung, E. Streicher, Proc. 48th IEEE Holm Conf. on Electrical Contacts, Orlando 2002, p. 21
• [8] S. Biyik, M.Sc. Thesis, Karadeniz Technical University, Trabzon 2008
• [9] E. Walczuk, P. Borkowski, S. Ksiezarek, W. Missol, Z. Rdzawski, K. Durst, Proc. 56th IEEE Holm Conf. on Electrical Contacts, Charleston 2010, p. 134
• [10] S. Biyik, M. Aydin, Proc. Int. Porous and Powder Materials Symp. and Ex., Izmir 2013, p. 145
• [11] ASM Handbook: Volume 2: Properties and Selection: Nonferrous Alloys and Special-Purpose Materials, ASM International, Ohio 1990
• [12] H.W. Turner, C. Turner, Copper in Electrical Contacts, CDA Publication, Hertfordshire 1997
• [13] ASM Handbook: Volume 7: Powder Metal Technologies and Applications, ASM International, Ohio 1998
• [14] L. Zhao, Z. Li, Y. Zhou, Proc. 1st Int. Conf. on Electric Power Equipment - Switching Technology, Xi'an 2011, p. 594
• [15] B. Miao, J. Xie, J. He, G. Liu, W. Wang, X. Wang, Proc. 25th Int. Symp. on Discharges and Electrical Insulation in Vacuum, Tomsk 2012, p. 189
• [16] X. Godechot, U. Ernst, L. Dalmazio, S. Kantas, M. Hairour, N. Fadat, Proc. 24th Int. Symp. on Discharges and Electrical Insulation in Vacuum, Braunschweig 2010, p. 206
• [17] O. Guler, E. Evin, J. Mater. Process. Tech. 209, 1286 (2009), doi: 10.1016/j.jmatprotec.2008.03.034
• [18] Y.P. Wang, B.J. Ding, IEEE T. Compon. Pack. T. 22, 467 (1999), doi: 10.1109/6144.796552
• [19] D. Gentsch, K. Gorlt, Proc. 25th Int. Symp. on Discharges and Electrical Insulation in Vacuum, Tomsk 2012, p. 213
• [20] Y. Han, J. Fan, T. Liu, H. Cheng, J. Tian, Int. J. Refract. Met. H. 29, 743 (2011), doi: 10.1016/j.ijrmhm.2011.06.010
• [21] M.A. Atwater, D. Roy, K.A. Darling, B.G. Butler, R.O. Scattergood, C.C. Koch, Mat. Sci. Eng. A-Struct. 558, 226 (2012), doi: 10.1016/j.msea.2012.07.117
• [22] M. Yusoff, R. Othman, Z. Hussain, Mater. Design. 32, 3293 (2011), doi: 10.1016/j.matdes.2011.02.025
• [23] Y. Li, S. Yu, Int. J. Refract. Met. H. 26, 540 (2008), doi: 10.1016/j.ijrmhm.2008.01.001
• [24] T. Raghu, R. Sundaresan, P. Ramakrishnan, T.R. Rama Mohan, Mat. Sci. Eng. A-Struct. 304, 438 (2001), doi: 10.1016/S0921-5093(00)01444-1

Identifiers

DOI

10.12693/APhysPolA.127.1255