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2014 | 126 | 1 | 150-151
Article title

Fine Smoothing of Conductive Substrate for Permalloy Layer Electroplating

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EN
Abstracts
EN
In this paper we study the influence of the roughness of the copper substrate on the magnetic properties of the FeNi film we electroplate onto it. The roughness and the thickness of the copper substrate are reduced by electropolishing in orthophosphoric acid: we show how to select the working point, which gives the highest smoothness, avoiding defects due to gas evolution. Finally we show how a smoother substrate contributes to reducing the coercivity of the magnetic film grown on it.
Keywords
Year
Volume
126
Issue
1
Pages
150-151
Physical description
Dates
published
2014-07
References
  • [1] X.P. Li, H.L. Seet, J. Fan, J.B. Yi, J. Magn. Magn. Mater. 304, 111 (2006), doi: 10.1016/j.jmmm.2006.01.132
  • [2] A.M. Awad, N.A. Abdel Ghany, T.M. Dahy, Applied Surface Science 256, 4370 (2010), doi: 10.1016/j.apsusc.2010.02.033
Document Type
Publication order reference
YADDA identifier
bwmeta1.element.bwnjournal-article-appv126n1071kz
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