An Investigation on Surface and Electrical Properties of Electrical Discharge Machined AISI D2 Tool Steel

• Authors: A. Durmus , A. Bayram , S. Gunes , S. Akay
• Languages of publication: EN

Abstracts

EN

The effects of pulse-on duration and finishing operation on the surface roughness and electrical resistivity of AISI D2 tool steel machined by the electrical discharge machining process are investigated. Experimental results indicate that surface roughness increased depending on the pulse-on duration. However, after the specific value, surface roughness is decreased. It can be seen that there are no notable effects of the pulse-on duration on the electrical resistivity, but the resistivity values are affected by the heat treatment and the finishing operation. Also, light microscopy and scanning electron microscopy have been used to study the characteristics of the surfaces.

Keywords

EN

52.80.-s; 81.65.-b

Discipline

• 81.65.-b: Surface treatments(for surface preparation and lithography in microelectronics, see 85.40.-e)
• 52.80.-s: Electric discharges(see also 51.50.+v Electrical properties of gases; for plasma reactions including flowing afterglow and electric discharges, see 82.33.Xj in physical chemistry and chemical physics)

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2014
• Volume: 125
• Issue: 2
• Pages: 515-517

Dates

published

2014-02

Contributors

author

A. Durmus

• Department of Mechanical Engineering, Faculty of Eng. and Arc., Uludag University, 16059 Bursa, Turkey

author

A. Bayram

• Department of Mechanical Engineering, Faculty of Eng. and Arc., Uludag University, 16059 Bursa, Turkey

author

S. Gunes

• Department of Chemistry, Faculty of Sciences and Arts, Uludag University, 16059, Bursa, Turkey

author

S. Akay

• Department of Chemistry, Faculty of Sciences and Arts, Uludag University, 16059, Bursa, Turkey

References

• 1. H.T. Lee, T.Y. Tai, doi: 10.1016/S0924-0136(03)00688-5, J. Mater. Process. Technol. 142, 676 (2003)
• 2. M.T. Yan, Y.P. Lai, doi: 10.1016/j.ijmachtools.2007.01.006, Int. J. Mach. Tools Manufact. 47, 1686 (2007)
• 3. Y.S. Liao, J.T. Huang, Y.H. Chen, doi: 10.1016/j.jmatprotec.2003.10.034, J. Mater. Process. Technol. 149, 165 (2004)
• 4. Y.H. Guu, H. Hocheng, C.Y. Chou, C.S. Deng, doi: 10.1016/S0921-5093(03)00272-7, Mater. Sci. Eng. A 358, 37 (2003)
• 5. M. Kiyak, O. Çakır, doi: 10.1016/j.jmatprotec.2007.03.008, J. Mater. Process. Technol. 191, 141 (2007)
• 6. H. Ramasawmy, L. Blunt, doi: 10.1016/S0924-0136(03)00652-6, J. Mater. Process. Technol. 148, 155 (2004)
• 7. T.A. Spedding, Z.Q. Wang, doi: 10.1016/S0924-0136(96)00033-7, J. Mater. Process. Technol. 69, 18 (1997)
• 8. J.S. Park, Y.K. Lee, doi: 10.1016/j.scriptamat.2006.10.007, Scr. Mater. 56, 225 (2007)
• 9. W.R. Runyan, Semiconductor Measurements and Instrumentation, McGraw-Hill, Tokyo 1975
• 10. F. Sevini, B. Acosta, L. Debarberis, doi: 10.1016/j.ijpvp.2006.03.006, Int. J. Pressure Vessels Piping 83, 525 (2006)
• 11. Ö. Salman, M.C. Kayacan, doi: 10.1016/j.jmatprotec.2007.09.022, J. Mater. Process. Technol. 200, 347 (2008)

Identifiers

DOI

10.12693/APhysPolA.125.515