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2013 | 123 | 4 | 637-641
Article title

Unstable Inverse Heat Transfer Problems in Microelectronics

Content
Title variants
Languages of publication
EN
Abstracts
EN
Inverse heat transfer problems are very important for the thermal testability of integrated circuits. Temperature sensors integrated on the same chip measure in real time the power dissipation in one or more critical heat sources of the circuit in order to prevent overheating. It will be demonstrated that these kinds of problems can give rise to mathematical unstabilities or the ill conditioning of the inverse problem. This statement will be proved with the help of several particular cases.
Keywords
EN
Publisher

Year
Volume
123
Issue
4
Pages
637-641
Physical description
Dates
published
2013-04
received
2012-08-06
(unknown)
2013-01-15
Contributors
author
  • University of Ghent, Department of Electronics and Information Systems, Sint Pietersnieuwstraat 41, 9000 Gent, Belgium
  • AGH University of Science and Technology, Institute of Electronics, al. A. Mickiewicza 30, 30-059 Kraków, Poland
author
  • AGH University of Science and Technology, Institute of Electronics, al. A. Mickiewicza 30, 30-059 Kraków, Poland
References
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  • 11. O. Alifanov, Inverse Heat Transfer Problems, Springer, New York 1994
  • 12. V. Székely, M. Tencz, S. Török, G. Farkas, Cs. Márta, in: Proc. Advances in the Thermal Testing of IC's 3rd Int. Workshop on Thermal Investigation of IC's and Microstructures (THERMINIC), Cannes, Ed: B. Courtois, CMP Laboratory, Grenoble 1997, p. 5
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Document Type
Publication order reference
Identifiers
YADDA identifier
bwmeta1.element.bwnjournal-article-appv123n402kz
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