Unstable Inverse Heat Transfer Problems in Microelectronics

• Authors: G. De Mey , B. Bogusławski , A. Kos
• Languages of publication: EN

Abstracts

EN

Inverse heat transfer problems are very important for the thermal testability of integrated circuits. Temperature sensors integrated on the same chip measure in real time the power dissipation in one or more critical heat sources of the circuit in order to prevent overheating. It will be demonstrated that these kinds of problems can give rise to mathematical unstabilities or the ill conditioning of the inverse problem. This statement will be proved with the help of several particular cases.

Keywords

EN

02.30.Zz; 44.05.+e; 85.40.Qx

Discipline

• 02.30.Zz: Inverse problems
• 44.05.+e: Analytical and numerical techniques
• 85.40.Qx: Microcircuit quality, noise, performance, and failure analysis

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2013
• Volume: 123
• Issue: 4
• Pages: 637-641

Dates

published

2013-04

received

2012-08-06

(unknown)

2013-01-15

Contributors

author

G. De Mey

• University of Ghent, Department of Electronics and Information Systems, Sint Pietersnieuwstraat 41, 9000 Gent, Belgium

author

B. Bogusławski

• AGH University of Science and Technology, Institute of Electronics, al. A. Mickiewicza 30, 30-059 Kraków, Poland

author

A. Kos

• AGH University of Science and Technology, Institute of Electronics, al. A. Mickiewicza 30, 30-059 Kraków, Poland

References

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Identifiers

DOI

10.12693/APhysPolA.123.637