Effect of Molding Condition on Waviness Profile of GFRP Composites in Compression Molding

• Authors: J. Kim , H. Kim , D. Lee
• Languages of publication: EN

Abstracts

EN

During compression molding of glass fiber reinforced plastic composites, annealing and quenching experiment is conducted by changing pre-heating and cooling method. As results, major cause of unevenness that affects waviness profile (winding) is the shrinkage of matrix during holding and cooling process. Waviness profile of the surface on molding in glass fiber reinforced plastic composites will be lower when holding pressure load is higher, mold temperature is lower during demolding, and cooling rate is slower. In addition, surface roughness of moldings is depending on holding pressure load compared with mold temperature. According to molding condition of glass fiber reinforced plastic composites, waviness profile of surface can be quantitatively estimated using the proposed equation.

Keywords

EN

81.05.Lg; 81.05.Qk; 88.30.mj

Discipline

• 88.30.mj: Composite materials
• 81.05.Lg: Polymers and plastics; rubber; synthetic and natural fibers; organometallic and organic materials(for polymers and organic materials in electrochemistry, see 82.45.Wx)
• 81.05.Qk: Reinforced polymers and polymer-based composites

• Journal: Acta Physica Polonica A
• Year: 2013
• Volume: 123
• Issue: 2
• Pages: 337-340

Dates

published

2013-02

Contributors

author

J. Kim

• NGV R&D Center, Gwangju Technopark, Chum-Dan Gwagiro 333, Buk-gu, Gwangju 500-706, South Korea

author

H. Kim

• Department of Advanced Parts and Materials Engineering, Chosun University Graduate School, 375 Seosuk-dong, Dong-gu, Gwangju 501-750, South Korea

author

D. Lee

• Department of Mechatronics Engineering, Chosun University, 375 Seosuk-dong, Dong-gu, Gwangju 501-750, South Korea

References

• [1] P. Lesiak, M. Szelag, K. Milenko, T.R. Wolinski, A.W. Domanski, K. Jedrzejewski, A. Boczkowska, , Acta Physica Polonica A 120, 698 (2011)
• [2] J.W. Kim, J.J. Lee, D.G. Lee, J. Mater. Process. Technol. 201, 755 (2008)
• [3] J.W. Kim, D.G. Lee, Trans. Nonferrous Met. Soc. China 21, 170 (2011)
• [4] J.W. Kim, D.G. Lee, J. Nanosci. Nanotechnol. 10, 3650 (2010)
• [5] H. Yaguchi, H. Hojo, D.G. Lee, E.G. Kim, J. Polym. Proc. Soc. 10, 262 (1995)
• [6] J.W. Kim, H.S. Kim, D.G. Lee, Adv. Sci. Lett. 8, 682 (2012)
• [7] J.W. Kim, H.S. Kim, D.G. Lee, Mater. Res. Innovations 15, 303 (2011)

Identifiers

DOI

10.12693/APhysPolA.123.337