EN
Ag_2Cu_2O_3 films were deposited on glass and silicon substrates by RF magnetron sputtering of metallic equimolar (Ag_{50}Cu_{50}) alloy target in Ar-O_{2} mixture at different substrate temperature (T_{s}) ranging between 303 and 523 K. The effect of T_{s} on the core level binding energies, structural and electrical properties of the films was systematically studied. The films deposited at room temperature were amorphous. The films deposited at 373 K were polycrystalline and the crystallinity was increased when the T_{s} was increased to 423 K. The films deposited at 423 K and subsequently annealed at 498 K exhibits single phase Ag_2Cu_2O_3. In the case of films deposited at higher T_{s} of 523 K, Ag_2O was decomposed into Ag. The electrical resistivity of the films deposited at 303 K was 1.2 × 10^{-5} Ω cm, whereas the films formed at 423 K and subsequently annealed at 498 K showed electrical resistivity of 2.2 × 10^{-3} Ω cm due to improvement in the crystallinity of single phase Ag_2Cu_2O_3.