Measurement Stand for TeraEYE Inspection

• Authors: M. Piszczek , M. Kowalski , M. Szustakowski
• Languages of publication: EN

Abstracts

EN

Image fusion can be used as one of imaging methods. Connection of images acquired using different acquisition methods can deliver information invisible for traditional one imaging technique. Visible and thermal images connected in one image give information about shapes and temperature map of objects seen by cameras. If we connect stereoscopic visible image and thermal image we will have three-dimensional object model covered with temperature map. Dividing three-dimensional objects on elementary surfaces we can model this object energetically. Energetic modeling of measurement scene allows verifying measurement data acquired from devices working in terahertz frequency range. This method requires many measurement scene parameters to be registered. Some of these parameters can be used in a hybrid modelling process.

Keywords

EN

02.60.-x; 42.30.Tz; 42.30.Sy

Discipline

• 42.30.Tz: Computer vision; robotic vision
• 02.60.-x: Numerical approximation and analysis
• 42.30.Sy: Pattern recognition

• Publisher: Institute of Physics, Polish Academy of Sciences
• Journal: Acta Physica Polonica A
• Year: 2011
• Volume: 120
• Issue: 4
• Pages: 720-724

Dates

published

2011-10

Contributors

author

M. Piszczek

• Institute of Optoelectronic, Military University of Technology, S. Kaliskiego 2, 00-908 Warsaw, Poland

author

M. Kowalski

• Institute of Optoelectronic, Military University of Technology, S. Kaliskiego 2, 00-908 Warsaw, Poland

author

M. Szustakowski

• Institute of Optoelectronic, Military University of Technology, S. Kaliskiego 2, 00-908 Warsaw, Poland

References

• 1. R. Ryniec, M. Piszczek, M. Szustakowski, Acta Phys. Pol. A 118, 1235 (2010)
• 2. N. Pałka, Acta Phys. Pol. A 118, 1229 (2010)
• 3. H. Quast, T. Löffler, 3D-Terahertz-Tomography for Material Inspection and Security, SynView GmbH, Glashuetten, Germany 2009
• 4. J.A. Walkenstein, W.B. Pardo, H.S. Robertson, M. Monti, Rev. Sci. Instrum. 11, 5385 (1995)
• 5. T. Pustelny, C. Tyszkiewicz, K. Barczak, Opt. Appl. 33, 469 (2003)
• 6. E. Maciak, Z. Opilski, T. Pustelny, M. Bednorz, J. Phys. IV (France) 129, 131 (2005)
• 7. X. Su-xia, G. Pei-yuan, C. Tian-hua, in: Proc. Int. Conf. on Measuring Technology and Mechatronics Automation, Paris (France) 2010, ICAL, Paris 2010, p. 347
• 8. Q. Wang, Yi. Shen, in: IMTC 2004 - Proc. Instrumentation and Measurement Technology Conf., IMTC, Coma 2004, p. 265

Identifiers

DOI

10.12693/APhysPolA.120.720