The electrical characteristics, and the range of interface metal-semiconductor reactions of Ti/Al/Ni/Au metallization with AlGaN/GaN heterostructures at various annealing temperatures ranging from 715°C to 865°C, have been investigated. The relation between the depth of the interface solid state reaction and the current-voltage (I-V) characteristics of the ohmic contact, have been studied. It was observed, that the transition from nonlinear to linear I-V behaviour occurred after the annealing at 805°C. The structural changes in AlGaN/GaN heterostructures beneath the metallic contact after the thermal treatment, were investigated. After removing the metallization by etching, the atomic force microscope profiles and scanning electron microscope images, were studied to define the depth to which the interfacial solid state reactions between the metallization and the semiconductor structure take place. It was observed, that the changes in the heterostructures, caused by the interface m-s reactions, were observed up to a depth of 180 nm at 865°C. In the worst case, this could result in the complete removal of the two-dimensional electron gas under the metallization of the ohmic contacts. To study the influence of the annealing process parameters on the properties of the two-dimensional electron gas, the van der Pauw Hall mobility measurement was performed.